The semiconductor industry (and the sectors it is serving) has been benefiting a lot from silicon wafer foundry service providers. In particular, the coming of advanced technologies like the fabless business model, provide the advantage of affordability - a crucial factor in maintaining the operational costs at a low level. With the help of foundry service providers' process capabilities, the production of semiconductor components (e.g. MEMS) have been efficient and cost-effective.
What are these process capabilities? Check out the following:
Lithography - also known as photolithography, it is a process that puts specific patterns on silicon wafers; the patterns are written on the substrates using a light sensitive polymer called photoresist. This process is essential to the production of semiconductor components that connect millions of transistors in a circuit.
Etching - in simpler terms, it is a process of making prints on the surface of the substrate or wafer. Several wafer foundry companies have a broad range of wet etching capability for 300mm and smaller diameters, for a broad range of dielectrics and metal films. They can also process non-standard sized substrates.
Wafer reclaim and recovery - the very purpose of this process is to extend the life of a wafer - for longer duration use. A wafer foundry company mechanically re-polishes wafers to remove surface scratches and residual patterns. While there is a certain limit on how many times a wafer can be reclaimed, still this process is considered a cost-effective solution for clients.
Thin films (dielectrics) - with this process capability, foundry companies use equipment like custom furnaces to facilitate processes like LPCVD and thermal oxide.
KISS Polishing - this process is utilized by foundry companies for the removal of minor surface scratches or defects on a substrate; this process involves visual inspection to find wafers with chips and cracks.
There are still a lot of process capabilities inside a silicon wafer foundry service facility - thanks to the people behind these innovations. Indeed, they play a key role for the semiconductor industry and the sectors it serves.
What are these process capabilities? Check out the following:
Lithography - also known as photolithography, it is a process that puts specific patterns on silicon wafers; the patterns are written on the substrates using a light sensitive polymer called photoresist. This process is essential to the production of semiconductor components that connect millions of transistors in a circuit.
Etching - in simpler terms, it is a process of making prints on the surface of the substrate or wafer. Several wafer foundry companies have a broad range of wet etching capability for 300mm and smaller diameters, for a broad range of dielectrics and metal films. They can also process non-standard sized substrates.
Wafer reclaim and recovery - the very purpose of this process is to extend the life of a wafer - for longer duration use. A wafer foundry company mechanically re-polishes wafers to remove surface scratches and residual patterns. While there is a certain limit on how many times a wafer can be reclaimed, still this process is considered a cost-effective solution for clients.
Thin films (dielectrics) - with this process capability, foundry companies use equipment like custom furnaces to facilitate processes like LPCVD and thermal oxide.
KISS Polishing - this process is utilized by foundry companies for the removal of minor surface scratches or defects on a substrate; this process involves visual inspection to find wafers with chips and cracks.
There are still a lot of process capabilities inside a silicon wafer foundry service facility - thanks to the people behind these innovations. Indeed, they play a key role for the semiconductor industry and the sectors it serves.
About the Author:
Paul Drake writes a wide array of high tech topics and he uses his work experience in a high tech company in his writing tasks. To know more about thermal oxide and other foundry services, visit Noel Tech Official Website.
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